3 Jobs: Job Vacancies for Director Positions
Senior Staff Advanced Package & Board TeamID:59718
15,000 MYR ~ 30,000 MYRBayan Lepas, Bayan Baru, Bandar Sunway/PuchongJob Description
The Senior Staff Advanced Package & Board Team will lead the design, development, and implementation of advanced IC packaging and board-level solutions that enable high-performance, cost-effective, and reliable silicon products. This role requires strong technical leadership across multiple engineering domains — including substrate/interposer design, board design, SI/PI/thermal analysis, and manufacturing interface — while driving cross-functional collaboration with silicon design, system architecture, and OSAT/EMS partners.The successful candidate will define and execute the company’s packaging and board technology roadmap to support next-generation chiplet-based architectures, 2.5D/3D integration, and heterogeneous systems.Key Responsibilities1. Leadership & Strategy• Lead the Advanced Package & Board Design Team, including substrate, interposer, and PCB design engineers.• Define and execute packaging and board technology strategy aligned with company silicon product roadmap.• Establish design and verification methodologies for advanced packaging (e.g., 2.5D, fan-out, chiplet integration).• Drive innovation in thermal management, signal integrity, and power delivery optimization.2. Technical Execution• Oversee design and validation of interposers, substrates, and system boards from concept to production release.• Guide integration of chiplets, HBM, and passive components using state-of-the-art packaging technologies.• Ensure robust SI/PI, mechanical, and thermal analysis for design sign-off.• Collaborate with silicon design teams on bump assignment, die floorplanning, and package co-design.• Manage board-level design for system bring-up, test platforms, and reference designs.3. Supplier & Ecosystem Management• Engage and qualify OSATs, substrate vendors, and PCB manufacturers to ensure quality and yield.• Partner with EDA vendors to establish design automation flow and DRC verification.• Drive technology transfer and pilot runs with manufacturing partners.4. Project & People Management• Plan resources, schedules, and budgets to ensure timely delivery of packaging and board design projects.• Build and mentor a high-performing team with expertise across electrical, mechanical, and materials engineering.• Foster collaboration across silicon, test, reliability, and operations teams.
Benefit
- Annual Leave
- Medical Leave
- Medical Insurance
- Dental/Optical RM500/year
- Outpatient RM1000/year
- Performance Bonus
- Yearly Increment[Japanese Speaker]General ManagerID:57904
10,000 MYR ~ 15,000 MYRKota Damansara/Petaling JayaJob Description
We are looking for a candidate who can lead our content creator and video production team, and take full responsibility for overall organizational management.Key Responsibilities:-Support HR tasks: recruitment coordination, onboarding/offboarding, attendance tracking-Handle basic accounting: invoice processing, payment tracking, bookkeeping-General admin: office supply management, document filing, scheduling, visitor support-Report to Director[Japan]
Benefit
Salary:RM10,000~15,000RM
Fixed transportation allowance: RM300
Annual Leave (AL): 10days
Medical Leave (MC): 14 days
Bonus: Equivalent to 1 month’s salary
Medical allowance: RM1,000–1,500 per year
Insurance: Includes business trips to Japan for training 1–2 times a year (approximately 1 week per trip)IP Engineering DirectorID:58600
25,000 MYR ~ 40,000 MYRBayan Lepas, Bayan BaruJob Description
Highly skilled and visionary IP Engineering Director, to lead the development and delivery of reusable semiconductor IP that powers advanced SoCs, chiplets, and multi-die solutions. This role requires deep expertise in semiconductor IP design, verification, and integration, combined with proven leadership in building and managing engineering teams. While the position is primarily focused on hardware IP development (digital, analog, or mixed-signal), software development experience—such as firmware, device drivers, or modeling frameworks—is a strong plus, enabling HW/SW co-design, system-level optimization, and accelerated customer adoption. The IP Engineering Director will define technical roadmaps, oversee execution, and collaborate with cross-functional teams to deliver silicon-proven IP solutions that meet aggressive power, performance, and area (PPA) targets.Key Responsibilities1. Leadership & Strategy• Define and execute the company’s IP engineering roadmap aligned with product strategy.• Build and lead a world-class IP engineering team across design, verification, validation, and integration.• Mentor and develop engineering leaders, fostering innovation, collaboration, and technical excellence.• Drive continuous improvement in design methodology, automation, and productivity.2. IP Development & Execution• Lead architecture, micro-architecture, and RTL design of reusable IP (e.g., memory interfaces, high-speed I/Os, interconnects, SerDes, or accelerators).• Oversee verification, validation, and sign-off, ensuring robust, silicon-proven IP delivery.• Collaborate with SoC, package, and system teams for seamless integration into chiplet and multi-die systems.• Support post-silicon debug, bring-up, and customer deployment of IP blocks.3. Cross-Functional Collaboration• Partner with software teams on firmware, drivers, and simulation frameworks to ensure full-stack enablement.• Engage with product, SoC, and system architects to align IP functionality with end-market requirements.• Collaborate with foundries, EDA vendors, and ecosystem partners to enhance IP design flows and deployment.4. Program Management & Delivery• Own IP program planning, milestones, schedules, and risk management.• Ensure timely delivery of high-quality IP to internal design teams and external customers.• Drive design reuse and scalability across multiple projects and product lines.5. Execution & Delivery• Own NoC project planning, execution, and delivery, ensuring schedule adherence and quality.• Establish and improve design methodologies, verification flows, and automation for rapid, reliable development.• Support bring-up, debug, and performance validation in both pre-silicon and post-silicon environments.
Benefit
- Annual Leave
- Medical Leave
- Medical Insurance
- Dental/Optical RM500/year
- Outpatient RM1000/year
- Performance Bonus
- Yearly Increment
