概述

• 薪资

  5,000 MYR ~ 8,000 MYR

• 产业类别

  Trading Firm

• 工作内容

  -Responsible for Service support equipment in semiconductor backend market
  -Product: Wire bonder, Die bonder which is for semiconductor
  *Installation/Modification/troubleshooting/parts replacement/provide trainings
  *Basically, work at customer site
  
  Details
  - Undertake full commission activities including installation, setup, configuration, software deployment, testing, customer commissioning, on site Buyoff until completion of Site Acceptance by customer
  - Close communication with customer, identify customer’s needs and initiate sales opportunities to increase service revenue.
  - Reporting all service activities in approved Service Management Systems and meet key performance indicators
  - Perform corrective maintenance on machines belong to customers; Perform preventive maintenance on schedule.
  - Perform service and recondition faulty equipment after repair; Perform pre-installation test, installation and commissioning of machines at customers’ sites.
  - Provide timely and proper report to customers after completion of a service call; Execute task assigned within response time; Check, track and monitor unclosed call till completion.
  - Provide professional and excellent service to customers and at times to fellow engineers when required; Maintain cordial relationships with customers, peer,s and fellow staff.
  - Facilitate Call Desk with a complete update after completing a service call on a timely manner; Ensure spare parts requested are returned promptly within the specified timeframe given.
  - Completion of manual FE report and return to Call Desk within 2 days.
  - Report to Technical Manager, Sales Manager