Field service engineer (Semiconductor / KL)ID:55497
5,000 MYR ~ 8,000 MYROther Selangor Districtabout 2 months agoOverview
Salary
5,000 MYR ~ 8,000 MYR
Industry
Trading Firm
Job Description
-Responsible for Service support equipment in semiconductor backend market
-Product: Wire bonder, Die bonder which is for semiconductor
*Installation/Modification/troubleshooting/parts replacement/provide trainings
*Basically, work at customer site
Details
- Undertake full commission activities including installation, setup, configuration, software deployment, testing, customer commissioning, on site Buyoff until completion of Site Acceptance by customer
- Close communication with customer, identify customer’s needs and initiate sales opportunities to increase service revenue.
- Reporting all service activities in approved Service Management Systems and meet key performance indicators
- Perform corrective maintenance on machines belong to customers; Perform preventive maintenance on schedule.
- Perform service and recondition faulty equipment after repair; Perform pre-installation test, installation and commissioning of machines at customers’ sites.
- Provide timely and proper report to customers after completion of a service call; Execute task assigned within response time; Check, track and monitor unclosed call till completion.
- Provide professional and excellent service to customers and at times to fellow engineers when required; Maintain cordial relationships with customers, peer,s and fellow staff.
- Facilitate Call Desk with a complete update after completing a service call on a timely manner; Ensure spare parts requested are returned promptly within the specified timeframe given.
- Completion of manual FE report and return to Call Desk within 2 days.
- Report to Technical Manager, Sales Manager
Qualifications
Requirement
[Must]
- Over Diploma/Degree
- 2 years of Engineer or field engineer experience related to Wire bonding or Die bonding
- Ability to read mechanical drawings
- Willing to travel and possess own transport (car).
[Prefer]
- Having experience die bonder or wire bonder machineEnglish Level
-
Other Language
English
Additional Information
Benefit
Salary: RM5,000 - 8,000
-Car Allowance RM 400 / month,(If the candidate use Train ,train allowance RM 200)
-Annual leave, Medical leave
-Medical fee:RM2000/year
-Local travel mileage :RM0.7/km
-Business trip allowance RM100/ more than 100 km (one way)
-Company phone/sim, Laptop will be provided by company.Working Hour
9:00 ~ 17:30
Holiday
Sat,Sun, National holiday
Job Function
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